Key Technical Specifications

• Amplifier Chip: Commonly utilizes the TPA3116D2 IC, known for high efficiency and low distortion (<0.1% THD).
• Operating Voltage: DC 4.5V to 24V.
• Output Power:
  • 50W x 2 (4Ω load at 21V).
  • 40W x 2 (8Ω load at 24V).
  • 17W x 2 (4Ω load at 12V).
• Dimensions: Ultra-compact at approximately 25 x 20 x 2.2 mm.
• Signal-to-Noise Ratio (SNR): 102 dB.
• Frequency Response: 20Hz to 20kHz. 

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Pin Definitions & Wiring

The module typically features a 10-pin layout for easy integration: 

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1. CS: Chip Select (High/Floating to boot; Low to shut down).
2. INR / INL: Right and Left channel audio signal inputs (+).
3. AGND: Audio signal common ground.
4. GND / VCC: Power supply ground and positive input.
5. SPL+ / SPL-: Left channel speaker output.
6. SPR+ / SPR-: Right channel speaker output. 

Important Usage Precautions

• Power Supply: Use a stable switching power supply or battery. Avoid exceeding 21V when using 4Ω speakers to prevent overheating.
• Heat Dissipation: At 12V, a heatsink is generally not required. For high-power output (above 17W or 21V), adding a heat sink is mandatory to prevent chip damage.
• Gain Management: The default gain is often high (36dB). If audio distortion occurs, you may need to reduce the input volume or short the gain pads on the board to lower it to 20dB or 26dB.
• Static Sensitivity: Avoid touching component pins while powered, as static electricity or human interference can damage the digital timing of the chip.